Horizontal In-Line System
- SuVAS™ H-Series are used to deposit thin-film layers, such as back electrode, CIG precursor, and TCO layers. The equipment operates with dual glass loading technology and cylindrical cathodes.
- Horizontal in-line type system
Minimizing particles inside the chamber
Simplified distributing using non-carrier transfer system
Maximizing the efficiency of target usage and improving quality of thin-film by target rotation and moving the magnet on the cathode part
Dual glass loading technology and cylindrical cathodes
High throughput and extended target utilization rate.
-Applicable Substrate Size
Max Gen 8th Substrate
Ag, Al, Al2O3, AlNd, AZO, CIGS, Cr, Cu, CuGa, CuIn, GZO, IGZO, In, ITO, IZO, Mo, MoTi, MoW, Ni, Se, SiO2, TiO2, ZnO
DC, Pulsed DC or MF
-Thickness Uniformity (%)
-Sheet Resistance Uniformity
Max 250℃ (Based on substrate temp.)
-Heating Temp. Uniformity