R&D
Performance
Advanced sputtering technology
- Plasma monitoring and thickness control, TFT active layer inspection, Magnetic levitation conveyance, Hybrid operation system, Under layer low damage deposition technology(Microwave applied)
- Isotopic Battery
- Equipment: Ni-63 plating equipment, unit cell junction equipment
- Key Technology: Ni-63 frontal deposition technology, radioactive material shielding technology, unit module integration technology
- Application: Radiation safety monitoring system power, standby power of military facilities
- Semiconductor Packaging
- Equipment: Ti-Cu Sputter
- Key Technology: Individual control of wafer, High Throughput, Structure of shield minimizing particle
- Application: Sputter for metal wiring deposition for WLP
- Steel Industry
- Equipment: Horizontal PVD
- Key Technology: Vacuum Lock, Plasma surface treatment technology
- Application: Automotive steel dry coating equipment
- Bio
- Equipment: Prostate treatment kit manufacturing equipment
- Key Technology: I-125(Iodine) packaging technology
- Application: Prostate cancer treatment kit
- Display
- Equipment: Microwave assisted sputter, active layer single membrane inspection equipment, magnetic levitation system, etc.
- Key Technology: Microwave transmission unit design technology, microwave leakage prevention technology, oxide semiconductor single membrane and TFT characteristic matching technology
- Application: Advanced Sputter
- Solar
- Equipment: High-speed heat treatment equipment applied with Se shower module
- Key Technology: Se shower module process control technology, Shower module structure H/W technology
- Application: CIGS thin film solar cell manufacturing equipment
