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Vertical In-Line System

Outline

  • SuVAS™ V-Series are used for thin film deposition by coating oxide (TCO and buffer layer) and metallic materials (back electrode) on large size substrate.

Features

  • Vertical in-line type system
    Minimizing the footprint and weight of the equipment throughout optimized design
    Minimizing particles inside the chamber using contactless transfer system (Magnetic Levitation System)
    Capable of forming multiple layers in one process cycle
    Maximizing the efficiency of target usage and improving quality of thin-film by moving the magnet on the cathode part

Specifications

  • -Applicable Substrate Size

    Max Gen 10.5th Substrate

    -Tact Time

    Within 60sec

    -Target Materials

    Ag, Al, Al2O3, AlNd, AZO, CIGS, Cr, Cu, CuGa, CuIn, GZO, IGZO, In, ITO, IZO, Mo, MoTi, MoW, Ni, Se, SiO2, TiO2, ZnO

    -Power Source

    DC, Pulsed DC or MF

    -Thickness Uniformity

    Within ±5%

    -Sheet Resistance Uniformity

    Within ±12%

    -Heating Temp

    Max 250℃ (Based on substrate temp.)

    -Heating Temp. Uniformity

    Within ±15℃